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| American Opto Plus LED C/A1501Y G/W 1.50'' Single Digit Seven Segment Display 1.50inch (38.10 mm) height Low power consumption RoHS Compliance Case mold type Package Dimensions Notes: 1. All dimensions are in millimeters (inches) 2. Tolerance is 0.25mm (0.01") unless otherwise specified Feb. 2005 Rev. 1.0 American Opto Plus LED C/A1501Y G/W 1.50'' Single Digit Seven Segment Display 1.50inch (38.10 mm) height Low power consumption RoHS Compliance Case mold type DEVICE SELECTION GUIDE Part Number C/A 1501Y G/W Material AlGaAs Chip Emitted Color Yellow Face / Segment Gray / White ABSOLUTE MAXIMUM RATINGS Parameter Power Dissipation per segment Peak Current per segment (1/10 Duty Cycle @1KHz ) Continuous Forward Current per segment Reverse Voltage Operating Temperature Range Storage Temperature Range (Ta=25C) Symbol PAD IAF IPF VR TOPR TSTG Max Rating 50 100 30 5.0 -40~+85 -40~+85 Unit mW mA mA V C C Solder temperature 1.6 mm from body for 3 seconds at 260C OPTICAL-ELECTRICAL CHARACTERISTICS Parameter Ave. Luminous Intensity Forward Voltage/segment Reverse Current/segment Spectrum Line Half-Width Dominant Wavelength Peak Wavelength Symbol Test Condition IV VF IR d p IF = 10mA IF = 10mA VR = 5V IF = 10mA IF = 10mA IF = 10mA Min 3000 Typ 8000 4.1 Max Unit cd 5.2 10 V uA nm nm nm 30 590 589 American Opto Plus LED C/A1501Y G/W 1.50'' Single Digit Seven Segment Display 1.50inch (38.10 mm) height Low power consumption RoHS Compliance Case mold type TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: YELLOW (Y) American Opto Plus LED C/A1501Y G/W 1.50'' Single Digit Seven Segment Display 1.50inch (38.10 mm) height Low power consumption RoHS Compliance Case mold type WAVE SOLDERING American Opto Plus LED C/A1501Y G/W 1.50'' Single Digit Seven Segment Display 1.50inch (38.10 mm) height Low power consumption RoHS Compliance Case mold type LAMP HANDLING AND APPLICATION PRECAUTIONS STORAGE 1. It is recommended to store the products in the following conditions: a. Humidity: 60% RH Max Temperature: 5C ~ 40C (41F ~ 105F) b. Shelf life in sealed bag: 3 month < 40C and 90% RH FORMING 1. Any forming on lead pin must be done before solding, not during or after soldering 2. Avoid applying any stress to resin in order to prevent the epoxy fracture and break on bonding wire. 3. While forming, please use a tie bar cut or equivalent ot hold or bend the pin. 4. 2mm from the base of resin is the minimum distance for the place bending the lead pin 5. Avoid bending the lead pin at the same point twice or more SOLDERING 1. No stress can be applied to lead pins when they are heated, otherwise disconnection may occur. 2. When an LED is mounted into a P.C. board, pitch spacing should be aligned carefully to avoid causing any stress to the lead wires. 3. Mounting direction (electrode direction) of SMD LED and Display should be perpendicular to direction of PCB curve 4. After soldering, don't bend the PCB CLEANING 1. Avoid using any unspecified chemical solvent to clean LED. For example, Trichoroethylene, Chlorosen, Acetone, and Diflon S3MC. 2. Any cleaning method can only be taken under normal temperature in one minute or less if it is required 3. Special attention should be taken when using any chemicals for claning because some chemicals may damage the surface of epoxy. |
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